ESSRBOND 223 is a heat transfer compound that is formulated with polydimethylsiloxane (PDMS) fluids in combination with metal oxides to provide superior thermal conductivity. It is designed to be used as a heat transfer paste in the electric and electronics industries.

EB 223 has good thermal conductivity, high dielectric constant and good insulation. It is non-drying & non-toxic. It stays stable at high temperatures.